At the SEMI European 3D TSV Summit, imec and Besi announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput. Through this collaboration, imec and Besi will pave the way to industrial adoption of thermocompression bonding for 3D IC manufacturing. 3D IC technology, stacking multiple dies into a single device, aims to increase the functionality and performance of next-generation in...